Highly Stable and Reliable Surface Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM5S
Strong Points of DO-218AB SM5S:
1. The chip inside is processed by globally leading technology of Chemical Etching Method, free from the negative effects caused by cutting stress.
2. DO-218AB has strong reverse surge capability, thanks to the chip's larger size than its competitors'.
3. Low leakage current from the edge of chip
4. TJ = 175 °C capability suitable for high reliability and automotive requirement
5. Low forward voltage drop
6. Meets ISO7637-2 surge specification (varied by test condition)
7. Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C
Steps of Chip Production
1. Mechanically Printing（Super-precise automatic wafer printing）
2. Automatic First-etching （Automatic Etching Equipment，CPK>1.67）
3. Automatic Polarity Test（Precise Polarity Test）
4. Automatic Assembly （Self-developed Automatic Precise Assembly）
5. Soldering (Protection with Mixture of Nitrogen & Hydrogen
Vacuum Soldering )
6. Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)
7. Automatic Gluing (Uniform Gluing & Precise Calculation are Realized by Automatic Precise Gluing Equipment)
8. Automatic Thermal Test (Automatic Selection by Thermal Tester)
9. Automatic Test(Multifunctional Tester)
