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High-quality Power Supply Module T1

Short Description:

Product Package: T1

Introduction: Thin high current packaging form, using high-purity, high-temperature epoxy resin for packaging, improving mechanical strength and moisture resistance, enhancing durability and high reliability. It is mostly used in switching power supply, converter, battery anti reverse connection protection and other applications.


Product Detail

Monitoring response time

Measuring range

Product Tags

Advantages of YUNYI's Power Supply Module T1:

1. Competitive cost with high-level quality.

2. High production efficiency with short lead time.

3. Stable and reliable under various natural environments.

4. Small size, helping to optimize the circuit board space

T1

Procedures of Chip Production:

1. Mechanically Printing(Super-precise automatic wafer printing)

2. Automatic First-etching (Automatic Etching Equipment,CPK>1.67)

3. Automatic Polarity Test(Precise Polarity Test)

4. Automatic Assembly (Self-developed Automatic Precise Assembly)

5. Soldering (Protection with Mixture of Nitrogen & Hydrogen Vacuum Soldering )

6. Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)

7. Automatic Gluing (Uniform Gluing & Precise Calculation are Realized by Automatic Precise Gluing Equipment)

8. Automatic Thermal Test (Automatic Selection by Thermal Tester)

9. Automatic Test(Multifunctional Tester)

芯片组装
芯片检测

Parameters:

Part Number Package VRWM
V
IO
A
IFSM
A
IR
Ma
VF
V
Trr
ns
SM090KD800G1 T1 800 90 2000 0.02 1.05
SM090KE800G1 T1 800 90 2000 0.02 1.05
SM090KC800G1 T1 800 90 2000 0.02 1.05
SM090KJ800G1 T1 800 90 2000 0.02 1.05

 


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